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<pre>Array ( [var] => cut_url ) </pre> Resume for Paul V. for Engineer / Computer Hardware in Shanghai, China. Search More Resumes for Engineer on Resumark.com #CMZJDUSY3
 

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Resume for Paul V. for Engineer / Computer Hardware in Shanghai, China




Occupation: Engineer Industry: Computer Hardware
Country: China City: Shanghai
State: Shanghai ZIP: 200031



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PAUL C V.   

Room

Yongjia Road

Shanghai, China  

Home:

Email:  

PROFILE 

Extensive experience in PRODUCT DEVELOPMENT and PROJECT MANAGEMENT.  Proficient at taking projects from concept to production using numerous Product Life Cycle Management PLC skills.  Accomplishments include: 

  • Led crossfunctional teams defining new products, setting project goals, schedules, and resource requirements with the goal of accelerated delivery of platforms to customers.
  • Development of system technical collateral, processes, and tools for customer system development, enable customer designs, and drive form factor changes into product offerings.
  • Provided direct system level support to key OEM/ODM during system development to remove technical roadblocks and enable a trouble free product launch and ramp into High Volume Manufacturing HVM.
  •  
     

    EXPERIENCE 

    MTI Micro Fuel Cells, Shanghai PRC, July to Present 

    Sr. Program Manager at MTI Micro Fuel Cells leading the Shanghai office to bringtomarket Mobion® offthe grid portable power solutions; a proprietary direct methanol micro fuel cell power system.  My team bridges the strategies and communications between R&D, vendors, and OEM/ODM’s to ensure our designs are the optimum solutions and then drive and facilitate the convergence of product development, manufacturing, and product planning to meet program goals. Manage regular design reviews to ensure manufacturability is achievable.  

    INTEL CORPORATION APAC R&D, Shanghai PRC, February to July  

    Sr. Program Manager at Intel China leading the development and execution of Form Factor Notebook Systems for customer initiatives validation.  The notebook systems enable chassis specific test Wireless/Thermal/Technologies and validation of roadmap mobile Silicon platforms. 

    Sr. Engineer at Intel China bringing to production concept notebook designs for emerging markets. Leading the Shanghai notebook design team from concept mockup to production ramp.  Responsibilities have included: stack up and thermal analysis, main board layout placement studies, industrial design management, materials selection, ODM and vendor management, system level testing, and analyzing customer change requests.  

    Sr. Engineer at Intel China leading a team for the architecture and thermal spec generation of the Hitachi Prius project. Managed the interface to the customer and Intel field team through weekly meetings and by documenting and presenting thermal/mechanical concepts. Negotiated with and influenced the customer to define the Form Factor of the system to meet thermal/acoustic targets. Successfully met the customer requirements for supporting mainstream Smithfield with low acoustics in a thin <mm thick form factor design. Led Intel team remotely through proof of concept mockup testing and report out to the customer. Primary interface to the customer and ODM for the project consulting. Author of technical content of the SOW.   

    INTEL CORPORATION, Hillsboro Oregon USA, June to February  

    Sr. System Technical Marketing Engineer for Intel’s Desktop Product Group driving account and internal stakeholders to new form factor adoption.  Regularly interface with senior engineers/managers to describe complex form factor interactions, impacts, and tradeoffs.  Provide creative solutions to complex problems. Technical voice of the customer providing direct regular support to key OEM/ODM for system level development. 

    Sr. Project Manager leading a Desktop Systems Development team which develops Technology Vehicles and Reference Platforms. Provide thermal/mechanical technical guidance to internal and external development teams. Manage the activity of ODM codevelopers.  Provide program management functions for project execution.  Function as the primary contact for Intel on assigned projects.  Interact with senior internal and external personnel on project issues across organizational lines.   

    Technical Engineering lead for the Intel startup Television Platform Operation TPO in the development of a reference chassis for Set Top Boxes.   Drove the system architecture to meet thermal and acoustic targets.  Managed the interface and design direction to the APAC ODM to provide the reference chassis.  Developed test plans and schedules.  Negotiated with TPO management on product features and requirements through this extremely vague and shifting program development.  Represented TPO as the prime contact with external customers and suppliers.

    Sr. Lead Mechanical Engineer and Chassis Program Manager for Intel’s InfiniBand Chassis.   Managed the mechanical project tooling and capital costs.  Maintained the program schedule and associated documentation.  Directed team to develop a chassis which meets Intel standards for thermal, EMI, and manufacturing.  Performed engineering design duties using ProEngineer as required to support project schedules. 

    Sr. Lead Mechanical Engineer for Intel Connected Products Division.  Managed the mechanical development of Intel’s PC Peripheral products from concept to manufacturing.   Teamed with Marketing Managers to define product features and requirements.  Managed part and tooling design reviews.  Directed Far East design and manufacturing suppliers to deliver high quality low cost products to meet Intel branded standards in HVM.   

    Sr. Lead Mechanical Engineer for Intel OEM Products and Services Division.  Managed sustaining team supporting the factory ramp and ongoing process improvements of an L integration of a SONY VIAO desktop system. The team successfully delivered to the goals for schedule, budget, product cost, product quality, and production ramp rate. Maintained the HVM process on the factory floor. Mentored and developed the team to follow Intel Product Life Cycle PLC processes by means of :'s, staff meetings, and scheduled training sessions 

    INTERNATIONAL BUSINESS MACHINES, Austin Texas USA, May to May  

    Worked on a variety of IBM products from mainframes to printers to RS workstations.  Involved in all aspects of the product development to HVM manufacturing. During HVM managed factory excursions. Experienced with plastic, sheet metal, and casting design.  All products designed to meet IBM environmental and manufacturability criteria.  Experienced as a Technical Marketing Engineer supporting IBM Printer Products.  Investigated, designed, and presented to customer’s requests for custom printer features.   

    EDUCATION 

    Bachelor of Science, Mechanical Engineering, Binghamton University

    Associate of Applied Science, Mechanical Technology, State University of New York at Canton 

    SKILLS 

    ProE, Catia, Cadam, Flotherm CAD tools.  MS Office and Project.  People, Program, and Supplier Management. 

    OTHER 

    Six United States Patents.


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