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PAUL C V.
Extensive experience in PRODUCT DEVELOPMENT
and PROJECT MANAGEMENT. Proficient at taking projects from concept
to production using numerous Product Life Cycle Management PLC skills.
Led crossfunctional teams
defining new products, setting project goals, schedules, and resource
requirements with the goal of accelerated delivery of platforms to customers.
Development of system technical
collateral, processes, and tools for customer system development, enable
customer designs, and drive form factor changes into product offerings.
Provided direct system level
support to key OEM/ODM during system development to remove technical
roadblocks and enable a trouble free product launch and ramp into High
Volume Manufacturing HVM.
MTI Micro Fuel Cells, Shanghai PRC, July
Sr. Program Manager at MTI Micro Fuel
Cells leading the Shanghai office to bringtomarket Mobion® offthe
grid portable power solutions; a proprietary direct methanol micro fuel
cell power system. My team bridges the strategies and communications
between R&D, vendors, and OEM/ODM’s to ensure our designs are
the optimum solutions and then drive and facilitate the convergence
of product development, manufacturing, and product planning to meet
program goals. Manage regular design reviews to ensure manufacturability
INTEL CORPORATION APAC R&D, Shanghai
PRC, February to July
Sr. Program Manager at Intel China leading
the development and execution of Form Factor Notebook Systems for customer
initiatives validation. The notebook systems enable chassis specific
test Wireless/Thermal/Technologies and validation of roadmap mobile
Sr. Engineer at Intel China bringing
to production concept notebook designs for emerging markets. Leading
the Shanghai notebook design team from concept mockup to production
ramp. Responsibilities have included: stack up and thermal analysis,
main board layout placement studies, industrial design management, materials
selection, ODM and vendor management, system level testing, and analyzing
customer change requests.
Sr. Engineer at Intel China leading a
team for the architecture and thermal spec generation of the Hitachi
Prius project. Managed the interface to the customer and Intel field
team through weekly meetings and by documenting and presenting thermal/mechanical
concepts. Negotiated with and influenced the customer to define the
Form Factor of the system to meet thermal/acoustic targets. Successfully
met the customer requirements for supporting mainstream Smithfield with
low acoustics in a thin <mm thick form factor design. Led Intel
team remotely through proof of concept mockup testing and report out
to the customer. Primary interface to the customer and ODM for the project
consulting. Author of technical content of the SOW.
INTEL CORPORATION, Hillsboro Oregon USA,
June to February
Sr. System Technical Marketing Engineer
for Intel’s Desktop Product Group driving account and internal stakeholders
to new form factor adoption. Regularly interface with senior engineers/managers
to describe complex form factor interactions, impacts, and tradeoffs.
Provide creative solutions to complex problems. Technical voice of the
customer providing direct regular support to key OEM/ODM for system
Sr. Project Manager leading a Desktop
Systems Development team which develops Technology Vehicles and Reference
Platforms. Provide thermal/mechanical technical guidance to internal
and external development teams. Manage the activity of ODM codevelopers.
Provide program management functions for project execution. Function
as the primary contact for Intel on assigned projects. Interact
with senior internal and external personnel on project issues across
Technical Engineering lead for the Intel
startup Television Platform Operation TPO in the development of a
reference chassis for Set Top Boxes. Drove the system architecture
to meet thermal and acoustic targets. Managed the interface and
design direction to the APAC ODM to provide the reference chassis.
Developed test plans and schedules. Negotiated with TPO management
on product features and requirements through this extremely vague and
shifting program development. Represented TPO as the prime contact
with external customers and suppliers.
Sr. Lead Mechanical Engineer and Chassis
Program Manager for Intel’s InfiniBand Chassis. Managed
the mechanical project tooling and capital costs. Maintained the
program schedule and associated documentation. Directed team to
develop a chassis which meets Intel standards for thermal, EMI, and
manufacturing. Performed engineering design duties using ProEngineer
as required to support project schedules.
Sr. Lead Mechanical Engineer for Intel
Connected Products Division. Managed the mechanical development
of Intel’s PC Peripheral products from concept to manufacturing.
Teamed with Marketing Managers to define product features and requirements.
Managed part and tooling design reviews. Directed Far East design
and manufacturing suppliers to deliver high quality low cost products
to meet Intel branded standards in HVM.
Sr. Lead Mechanical Engineer for Intel
OEM Products and Services Division. Managed sustaining team supporting
the factory ramp and ongoing process improvements of an L integration
of a SONY VIAO desktop system. The team successfully delivered to the
goals for schedule, budget, product cost, product quality, and production
ramp rate. Maintained the HVM process on the factory floor. Mentored
and developed the team to follow Intel Product Life Cycle PLC processes
by means of :'s, staff meetings, and scheduled training sessions
INTERNATIONAL BUSINESS MACHINES, Austin
Texas USA, May to May
Worked on a variety of IBM products from
mainframes to printers to RS workstations. Involved in all
aspects of the product development to HVM manufacturing. During HVM
managed factory excursions. Experienced with plastic, sheet metal, and
casting design. All products designed to meet IBM environmental
and manufacturability criteria. Experienced as a Technical Marketing
Engineer supporting IBM Printer Products. Investigated, designed,
and presented to customer’s requests for custom printer features.
Bachelor of Science, Mechanical Engineering,
Associate of Applied Science, Mechanical
Technology, State University of New York at Canton
ProE, Catia, Cadam, Flotherm CAD tools.
MS Office and Project. People, Program, and Supplier Management.
Six United States Patents.