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<pre>Array ( [var] => cut_url ) </pre> Resume for Daniel D. for Engineer / Engineering Services in North Salt Lake, Utah. Search More Resumes for Engineer on Resumark.com #1HRABEYI4
 

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Resume for Daniel D. for Engineer / Engineering Services in North Salt Lake, Utah




Occupation: Engineer Industry: Engineering Services
Country: United States City: North Salt Lake
State: Utah ZIP: 84054



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Daniel N. D.

     East Fairway Dr.

North Salt Lake, UT

       cell

home

   dandon  
 

SUMMARY:  

I offer a uniquely defined career with skills built on experience in the electronics industry featuring broad functional experience in analysis, design and management; employment history includes firms involved in different aspects of electronics. My unifying career threads are integration and reliability engineering.  

PROFESSIONAL EXPERIENCE: 

kilometers®, North Salt Lake, UT     / present

Engineering and scientific consulting  

Owner CEO A general engineering practice with specific focus on the western region defined by a radius of kilometers from Salt Lake City. This region includes cites including Denver, Las Vegas, Phoenix, Portland, San Francisco, San Jose and Silicon Valley.  

Exponent Failure Analysis Associates, Menlo Park, CA    //

Exponent is a leading engineering and scientific consulting firm. 

Managing Engineer Working to build a practice supporting the broad electronics industry through personal promotion, leadership, technical work and communications. This work begins by finding and establishing new clients or supporting existing clients. Failure analysis techniques include standard laboratory methods such as optical microscopy, lab benchtop testing and accelerated testing but also include acoustic microscopy, SEM/EDS, XPS, FTIR. The work includes communication through numerical analysis and written and verbal means including formal reports, teleconferences, presentations and oneonone discussions.  

University of Maryland, College Park, MD     //

CALCE, Electronic Products and Systems Center 

Assistant Research Scientist Serving technical needs of industrial member companies in a university research setting. The main projects involved ceramics, aspects of electronics industry economics, scanning electron microscopy and other failure analysis techniques. Served as an instructor for a graduate course on sensors.  

Iomega Corporation, Roy, UT       //

Iomega is the leading producer of removable storage.  

Chief Technologist Leading new technologies, providing interface between Management in Iomega and key new suppliers.  Position focuses on work with Marketing on new product development and innovative applications of existing products.  

Compaq Computer Corporation, Houston, TX     //

Compaq is the leading manufacturer of Personal Computers. 

Principal Member of the Technical Staff Promoted to Senior Member / and to

Principal Member / from manager of reliability. This technical leadership position provides design and

reliability support across the entire Compaq product line to remedy potential or actual failures of products by determining the true root cause the Physics of Failure Approach. Review of design often leads to the personal contribution of innovative design concepts.  

  • Achieved Compaq's "Customer Advocate Award" in March of for work on improving engineering processes across all Divisions.
  • Lead a team to change the PCMCIA Card Standard for thermal rating and worked to change UL
  •  
     

    Teledyne, CME, Santa Clara, CA      //

    Teledyne, CME built military electronic countermeasures equipment. 

    Mechanical Engineering Section Manager Responsible for Mechanical Design and

    Analysis of CME's electronic products. Project Management of the design process

    included proposal activity, analysis, documentation and troubleshooting.  
     

    Ford Aerospace Corporation, San Jose, CA     // 

    Ford Aerospace built a wide variety of military and commercial communications electronics.  

    Engineering Specialist Design Engineer for electronic Ground Equipment Systems.   

  • Performed worldwide facilities tour for thermal, structural, facilities and electrical upgrades and served as cognitive engineer on thermal design for building scale and rack scale design.
  •  

    Motorola, GEG, Scottsdale, AZ      //

    Motorola, GEG built a wide of military electronics with emphasis on leading edge

    high technology applications.  

    Sr. Staff Engineer Served as Design Engineer, Assistant Project Leader and Systems Engineer on a wide variety of rugged electronics systems.   

  • Worked on challenging very "high g" packaging in artillery fuzes.
  •  

    Lockheed, Missiles and Space Corporation, Sunnyvale, CA    //

    LMSC built a variety of military and commercial products including the Polaris Missile and the Hubble Space Telescope.  

    Sr. Engineer Thermal Analyst for Life Support Systems and spacecraft thermal control.  
     

    University of Illinois, Urbana, IL      // 

    Graduate Assistant Researcher on campus energy conservation project and

    Teaching Assistant. 

  • Experience with computer operating systems, source code, system simulation applications, thermal modeling and statistical analysis
  •  

    PART TIME EXPERIENCE:  

    Instructor, Scottsdale and Glendale Community Colleges in Statistics and Electronics. // 

  • My "Toastmasters experience"
  •  

    EDUCATION: 

    B.S., , General Engineering, University of Illinois at Urbana.

    M.S., , Mechanical Engineering, University of Illinois at Urbana.

    M.B.A., , Business Administration, Santa Clara University.

    Ph.D., , Mechanical Engineering, University of Maryland, College Park.

     

    PROFESSIONAL STATUS:  

    Registered Professional Engineer P.E. in Arizona, California and Utah

    Certified Reliability Engineer CRE by the American Society for Quality ASQ 

    PERSONAL INFORMATION:  

    Member, American Mensa 

    PROFESSIONAL MEMBERSHIPS and ACTIVITIES: 

  • Senior Member, Institute for Electrical and Electronics Engineers;
  • Chairman, Santa Clara Valley CPMT Chapter , Granted “ CPMT Chapter of the Year” award, Vice Chair ,  Secretary, Santa Clara Valley CPMT Chapter ;
  • Associate Editor, IEEE Transactions on Components, Packaging, and Manufacturing Technology CPMT since February ,
  • MemberatLarge, IEEE CPMT Board of Governors, .
  • Member of the IEEE Nanotechnology Council Executive Committee ,
  • Member of Consultants Network of Silicon Valley
  • Director of the Silicon Valley Engineering Council SVEC ,
  • and Engineers Banquet Committee;
  • Chief Editor SVEC Journal, , Feb.
  • Member, Materials Research Society MRS
  • Member, American Society of Mechanical Engineers ASME,
  • Session Chair Interpack
  • Member, American Society of Heating, Refrigerating and Air Conditioning Engineers ASHRAE
  • Member, International Microelectronics and Packaging Society IMAPS
  • Senior Member, American Society for Quality ASQ
  • Member, Utah Technology Council UTC
  • PUBLICATIONS:  

    “Ceramics in Electronics” with Poliskie, G., IMAPS Advancing Microelectronics, May/June In Press. 

    “Plastics in Electronics” with Poliskie, G., Silicon Valley Engineering Council Journal”, Volume , , February , pp. .  

    “Thermal Aspects of LED Automotive Headlamps”, IEEE Vehicle Power and Propulsion Conference, Sept , Dearborn, MI, pp. . 

    “The Chemistry of Halogen Free Electronics” with Poliskie, G., IMAPS Advancing Microelectronics, Vol. , No. , July/August, , pp. . 

    “Silicon Valley Engineering Council Journal”, Volume , , February Editor. 

    “Contributions of the University of Illinois to Silicon Valley”, Engineering at Illinois, , January . 

    “Electronics Reliability, More than Temperature”. Continuity, Newsletter of the Electronics and Communication Division, ASQ, Winter , January , pp.. 

    “Accelerated Life Testing” with Zhao, K., Murray, S., Ray, R., Wiley Encyclopedia of Quantitative Risk Assessment, . 

    “Engineers Week: How Things Have Changed Since .” Utah Engineers Council Journal, pp. , February . 

    “Moisture Induced Degradation of Multilayer Ceramic Capacitors,” Journal of Microelectronics Reliability, Vol. , Issues , pp. , February–April with M. Pecht, I. Lloyd and S. Ganesan. 

    “New Aging Mechanism in Multilayer Ceramic Capacitors,” Advanced Packaging Magazine, June with M. Pecht. 

    “Moisture in Multilayer Ceramic Capacitors,” Ph.D. Thesis, University of Maryland at College Park, January . Note: Dissertation has been downloaded from the university library well over times. 

    “The Transition of Electronics to China,” Chapter in China's Electronic Industry, M. Pecht, and Y. Chan eds., CALCE Press, pp. , College Park, MD, . 

    “Determination of the Life Cycle Environment,” Chapter in China's Electronic Industry, M. Pecht ed., WileyInterscience, pp. , Hoboken, NJ, with N. Vijayaragavan and M. Pecht. 

    “Are U.S. Jobs Moving to China?” IEEE CPT, pp. –, September with M. Pecht. 

    “Failures in Base Metal Electrode BME Capacitors,” rd Annual CARTS Proceedings, pp. –, April , with C. Hillman and M. Pecht. 

    “China's Electronic Manufacturing Services,” Chapter in China's Electronic Industry, M. Pecht and Y. Chan eds., CALCE Press, College Park, MD, pp. , with J. Wu, Q. Haiyu, and D. D.. 

    “Reliability and Assessment of Electronic Systems and Equipment,” IEEE CPT, pp. –, March with J. Cartwright and M. Jackson. 

    “Bedrock of Electronics,” Mechanical Engineer, pp. –, November. . 

    “CERDIPS as Gun Rugged Artillery Fuze Components,” ASME Winter Annual Meeting, December with A. Meyer and K. Hanson. 

    “A Computer Model of a Campus Building,” M.S. Thesis, University of Illinois at UrbanaChampaign, May . 

    “Energy Survey—Reduction of Energy Consumption,” B.S. Thesis, University of Illinois at UrbanaChampaign, May with G. Bloomberg, S. Mair, and D. Nelson.

    PRESENTATIONS:  

    “Economics of Technology and the Engineering Career,” Joint Meeting of IEEE GOLD and the University of Utah IEEE Student Branch, Salt Lake, UT, October  . 

    “Thermal Aspects of LED Automotive Headlamps”, IEEE Vehicle Power and Propulsion Conference, Dearborn, MI, Sept . 

    “LED Automotive Headlights”, IEEE Utah Section, Salt Lake, August, . 

    “Halogen Free Electronics with G. Poliskie,” IEEE CPMT and PSES Santa Clara Valley Chapters, Sunnyvale, CA, December . 

    “Contributions of the University of Illinois to Silicon Valley,” Technology Entrepreneur Center, Champaign, IL, November . 

    “Heat Transfer Applied to Electronics Design,” Refrigeration and Air Conditioning Center, Champaign, IL, November . 

    “The rocky marriage of technology and quality, how technological maturity drives quality both up and down,” ASQ Golden Gate Section, Jack London Square, February , and San Jose State University April . 

    “CPMT Santa Clara Valley Report,” IEEE/Santa Clara Valley Section Executive Committee, September . 

    “Running a Successful Chapter,” IEEE/Santa Clara Valley Section Officer Chapter Training, January . 

    “Economics of Technology and the Engineering Career,” San Jose State University, April panel discussion. 

    “RoHS: of , Eutectic tinlead solder is one of prohibited substances,” ASME/Santa Clara Valley Chapter, Menlo Park, CA, April with A. FaschingJames. 

    “Economics of Technology and the Engineering Career,” Joint Meeting of the IEEE CPMT and GOLD Chapters, Sunnyvale, CA, April with G. Poliskie. 

    “Drift in Multilayer Ceramic Capacitors,” IEEE CPMT Santa Clara Valley Chapter, Sunnyvale, CA, Feb. . 

    “Connect with and Strengthen Your Supply Chain,”


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