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<pre>Array ( [var] => cut_url ) </pre> Resume for raunak K. for Engineer / Engineering Services in Taichung, Taiwan. Search More Resumes for Engineer on Resumark.com #2364PPN7L
 

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Resume for raunak K. for Engineer / Engineering Services in Taichung, Taiwan




Occupation: Engineer Industry: Engineering Services
Country: Taiwan City: Taichung
State: T'ai-wan ZIP: 41354



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Raunak K.
, Lioufeng Rd., Wufeng, Taichung , Taiwan ROC Em
Contact
Objective :
To obtain a position which utilizes my skills in your organization, to work in
a fast paced, professional and competitive environment, which can harness my skills and
allow me to be a part of its vision and helps me in growing along with it.
Education
August June
Asia University, Taichung, Taiwan
GPA=/
MS Semiconductor, Computer Science
and information engineering
August May
BMS Institute of Technology Bangalore
.%
B.E, Mechanical Engineering
Chinmaya Vidyalaya, Jharkhand
.%
+
Bal Vidya Niketan, Bihar
.%
th
Publications
.“Analysis of SiN Passivation effect by SelfConsistent ElectroThermalMechanical
Simulation in AlGaN/GaN Heterostructure HEMTs.”, Raunak K., Abijith Prakash,
Briliant.Adhi.Prabowo, Anumeha, JungRuey Tsai, Gene Sheu, ShaoMing Yang and
Yufeng Guo Published to
th
ICEMI, Chengdu, China.
. “Investigation of Passivation Effect of SiO Layer on AlGaN/GaN HEMT by Self
Consistent ElectroThermal Simulation Coupled with Mechanical Analysis. ”, Abijith
Prakash, Raunak K. Briliant.Adhi.Prabowo, Anumeha, Manoj K., ShaoMing
Yang, Gene Sheu and JungRuey Tsai, Published to
th
ICEMI, Chengdu, China.
. “SelfConsistent ElectroThermalMechanical Analysis of AlN Passivation Effect on
AlGaN/GaN HEMTs.” Briliant.Adhi.Prabowo, Anumeha, Abijith Prakash, Raunak K.,
Gene Sheu, JungRuey Tsai and ShaoMing Yang
Published to IEEE Communication letters.
Courses Undertaken
. Graduate Courses:
Fall courses:
Semiconductor Physics, Semiconductor Process Engineering, Product Engineering,
Integrated Circuit
Spring Courses:
Analog Circuit, Semiconductor Failure Analysis, Microelectronics, Integrated Circuit Testing
. Undergraduate Courses:
Engineering Physics, Material Science and Metallurgy, Basic Electronics, Basic Electrical
Engg., Mechanics of Material, Kinematics of Machines, Manufacturing Process, Design of
Machine Element, Modelling and Finite Element Analysis, Mechatronics and
Microprocessor, Computer Aided Modelling and Analysis, Statistical Quality Control
Projects
. Studies of the properties of AlSi composite material. Bachelor’s Project
. Calibration and Simulation of High Voltage P Body PNP device .µm CMOS
Process.
. Hetrostructure HEMT AlGaN/GaN device Simulation with passivation layer to improve
the current degradation.
. Thermal Characterization and energy capability of LDMOS.
. Working on ESL/ESR Simulation of Deep Trench Capacitors for DRAM.
. Hands on experience on wafer measurement on Cascade .BCD measurement and
TLP measurement on Barth . During my Internship at TSMC
. Improvement of UHV device breakdown V with PTOP technology.
. An Investigation of Breakdown Rolloff and ESD on MultiFinger PNP BJT Device with
Different Base Width and Monte Carlo Simulation. Master’s THESIS
Positions Of Responsibility/ Experience
years of extensive experience in Semiconductor devices as Research Assistant at
Centre for Computational Microelectronics, Asia University, Taiwan, Sep’ – PRESENT.
Internship program
I completed my summer internship at Taiwan Semiconductor Manufacturing Company
TSMC, Hsinchu Taiwan on the topic “High Current Gain and High Cutoff
Frequency GHz NPN BJT Device” under guidance of Alex Kalnitsky, Senior
Director TSMC.
Computer Language/Tools
 TCAD Simulation with TsupremD Process and device Simulation and
SentaurusD/D Process and Device Simulation and Hspice
 ANSYS, CIM, computer aided engineering design
 Windows //XP/Linux
CoCurricular Activities
. Participated in various quizzes, essay and letter writing competitions.
. Contributed towards exhibitions and displays at school functions.
. Member of school cricket team.
. Member of Indian Society for Technical Education [ISTE] Student Chapter.
Declaration: I hereby declare that the above information and particulars are correct to
the best of my knowledge.
Place:Taichung
Date:/

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